Multilayer printed circuit board for high-speed di

专利名称：Multilayer printed circuit board for high-speed differential signal, communicationapparatus, and data storage apparatus

发明人：Hideki Osaka申请号：US11601734申请日：20061120公开号：US07448880B2公开日：20081111

专利附图：

摘要：In the case where high speed differential signals are transmitted in differentialtransmission lines through via holes with open-stubs, signal waveforms are distorted due

to impedance mismatch in the open-stubs of the via holes, thus causing jitter, which hasbecome an issue of high speed signals. For differential transmission lines that passthrough via holes with open-stubs, a degree of coupling of the lines is decreased whilethe differential characteristic impedance is made constant. Thereby, the effects ofbackward cross talk noise caused by the coupling can be minimized, and thus jitter can besuppressed.

申请人：Hideki Osaka

地址：Oiso JP

国籍：JP

代理机构：Reed Smith LLP

代理人：Stanley P. Fisher, Esq.,Juan Carlos A. Marquez, Esq.

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