DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD

专利名称：DIE PACKAGE INCLUDING ENCAPSULATED

DIE AND METHOD OF MANUFACTURINGTHE SAME

发明人：Joon Seok KANG,Young Do Kweon,Hong

Won Kim,Jingli Yuan

申请号：US12547284申请日：20090825

公开号：US20100320624A1公开日：20101223

专利附图：

摘要：Disclosed herein is a die package including an encapsulated die, including: a die

including pads on one side thereof; an encapsulation layer covering lateral sides of thedie; a support layer covering the encapsulation layer and one side of the die; a passivationlayer formed on the other side of the die such that the pads are exposed therethrough;and a redistribution layer formed on the passivation layer such that one part thereof isconnected with the pad. Here, since one side of the die is supported by the support layerand the encapsulation layer is formed on only the lateral side of the die, the warpage ofthe die package due to the difference in thermal expansion coefficient can be minimized.

申请人：Joon Seok KANG,Young Do Kweon,Hong Won Kim,Jingli Yuan

地址：Gyunggi-do KR,Seoul KR,Gyunggi-do KR,Gyunggi-do KR

国籍：KR,KR,KR,KR

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