AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Features
• • • • • • • • • •
Wide input voltage range: 1.5V – 6V Low RDS(ON): 80mΩ typical @ 5V Turn-on slew rate controlled
AP2281-1: 1ms turn-on rise time
AP2281-3: 100us turn-on rise time with internal discharge Very low turn-on quiescent current: << 1uA Fast load discharge option
Temperature range -40ºC to 85°C
SOT26: Available in “Green” Molding Compound (no Br, Sb)
Lead Free Finish/ RoHS Compliant (Note 1)
Description
The AP2281 slew rate controlled load switch is a single P-channel MOSFET power switch designed for high-side load-switching applications. The MOSFET has a typical RDS(ON) of 80mΩ at 5V, allowing increased load current handling capacity with a low forward voltage drop. The turn-on slew rate of the device is controlled internally.
The AP2281 load switch is designed to operate from 1.5V to 6V, making it ideal for 1.8V, 2.5V, 3.3V, and 5V systems. The typical quiescent supply current is only 0.01uA.
Applications
• • • • • •
Smart Phones PDA
Cell Phones GPS Navigators PMP/MP4
Notebook and Pocket PC
Ordering Information
AP2281-XXXXTurn-on rise time
1 : 1ms3 : 100us
PackageW : SOT26
Lead FreeG : Green
Packing-7 : Tape & Reel
Note: 1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
Packaging 7” Tape and Reel (Note 2) Quantity Part Number Suffix
AP2281-1W W SOT26 3000/Tape & Reel -7 AP2281-3W W SOT26 3000/Tape & Reel -7 Device
Package Code
Note: 2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf
AP2281 Rev. 1 1 of 9 JANUARY 2008 www.diodes.com © Diodes Incorporated
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Pin Assignments
(Top View)
OUT1GND2EN3SOT26
6IN5GND4IN
Pin Description
Pin Name OUT GND ENIN
Pin Number
1 2, 5 3 4, 6
Description
Voltage output pin. This is the pin to the P-channel MOSFET drain connection. Bypass to ground through a 0.1uF capacitor. Ground.
Enable input, active high
Voltage input pin. This is the pin to the P-channel MOSFET source. Bypass to
ground through a 1µF capacitor.
Options
Part Number
Slew Rate (typ)
Active pull down
no yes
Enable
Active high Active high AP2281-1 1ms AP2281-3 100us
AP2281 Rev. 1 2 of 9 JANUARY 2008 www.diodes.com © Diodes Incorporated
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Block Diagram
INSlew Rate ControlOUTGND
For AP2281-3 onlyEN
Typical Application Circuit
VININOUTVOUT1uFEnableENGND 0.1uF
AP2281 Rev. 1 3 of 9 JANUARY 2008 www.diodes.com © Diodes Incorporated
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Absolute Maximum Ratings
Symbol VIN VOUT VEN Iload TJ TST PD
Parameter
Input voltage Output Voltage Enable Voltage
Maximum Continuous Load Current Operating Junction Temperature Range Storage Temperature Range Power Dissipation SOT26 (Note 3, 4) Ratings
6.5 VIN + 0.3 6.5 2 -40 ~ 125 -65 ~ 150 720 Unit V V V A °C °C mW
Note: 3. TJ, max =125°C.
4. Ratings apply to ambient temperature at 25°C.
Recommended Operating Conditions
Symbol VIN IOUT TA
Parameter
Input voltage Output Current
Operating Ambient Temperature
Min 1.5 0 -40
Max 6.0 2.0 85
Unit V A °C
Electrical Characteristics
o
(TA = 25C, VIN= 5.0V, unless otherwise stated) Symbol IQ ISHDN ILEAK RDS(ON) VIL VIH ISINK TD(ON) TON TD(OFF) RDISCH θJA θJC
Note: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
Parameters
Input Quiescent Current Input Shutdown Current Input Leakage Current Switch on-resistance EN Input Logic Low Voltage EN Input Logic High Voltage EN Input leakage
Output turn-on delay time Output turn-on rise time Output turn-off delay time Discharge FET on-resistance Thermal Resistance Junction-to-Ambient Thermal Resistance Junction-to-case
Test Conditions
VEN = VIN, IOUT = 0 VEN = 0V, OUT open VEN = 0V, OUT grounded VIN = 5.0V VIN = 3.3V VIN = 1.8V VIN = 1.5V
VIN = 1.5V to 6V VIN > 2.7V
VIN = 1.5V to 2.7V VEN = 5V Rload = 10Ω
AP2281-1, Rload = 10Ω AP2281-3, Rload = 10Ω Rload = 10Ω
For AP2281-3 only, VEN = GNDSOT26 (Note 5) SOT26 (Note 5)
Min Typ. Max Unit ⎯ 0.01 1 μA ⎯ 0.01 1 μA ⎯ 0.01 1 μA 80 100 mΩ 95 120 mΩ 160 210 mΩ 210 280 mΩ 0.4 V 2.0 V 1.4 V
1 ⎯ μA 1 μS 1000 1500 μS 100 150 μS 0.5 1 μS 65 100 Ω
153 29
o
C/W C/W
o
AP2281 Rev. 1 4 of 9 JANUARY 2008
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
Quiescent Current vs. Input Voltage0.010Quiescent Current vs. TemperatureQuiescent Current (μA)VIN=1.8V0.008VIN=3.3VVIN=5.0V0.0060.01Quiescent Current (μA)0.0080.0060.0040.0040.0020.00201.02.03.04.05.06.0Input Voltage (V) 0.000-50-250255075100125Temperature (°C)
RDS(ON) vs. Input Voltage300.00I=100mA250.00I=500mAI=1AI=2A200.00
RDS(ON) vs. Temperature200.00180.00160.00RDS(ON) (mΩ)RDS(ON) (mΩ)140.00120.00100.0080.0060.0040.0020.00VIN =1.8VVIN =3.3VVIN =5V150.00100.0050.001.522.533.544.555.560.00-50-250255075100Input Voltage (V)Temperature (°C)
ENABLE Threshold vs. Input Voltage1.8ON/OFF Threshold (V)
Input Shutdown Current vs. Temperature0.0100.0081.61.4ISHDN (μA)VIL (V)VIH (V)1.21.00.80.60.41.52.02.53.03.54.04.55.05.56.00.0060.0040.0020.000-50-250255075100125Input Voltage (V)Temperature (°C)
AP2281 Rev. 1 5 of 9 JANUARY 2008
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics (Continued)
AP2281-1 Turn-On
(VIN=3.3V, RL=7Ω)
VEN (5V/div)
VEN (5V/div)
AP2281-1 Turn-Off
(VIN=3.3V, RL=7Ω)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
Time (500μs/div)
IIN (500mA/div)
Time (50μs/div)
AP2281-1 Turn-On (VIN=5V, RL=10Ω)
VEN (5V/div)
AP2281-1 Turn-Off (VIN=5V, RL=10Ω)
VEN (5V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (50μs/div)
Time (500μs/div)
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics (Continued)
AP2281-3 Turn-On
(VIN=3.3V, RL=7Ω)
VEN (5V/div)
VEN (5V/div)
AP2281-3 Turn-Off
(VIN=3.3V, RL=7Ω)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
Time (50μs/div)
IIN (500mA/div)
Time (50μs/div)
AP2281-3 Turn-On (VIN=5V, RL=10Ω)
VEN (5V/div)
AP2281-3 Turn-Off (VIN=5V, RL=10Ω)
VEN (5V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (50μs/div)
Time (50μs/div)
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Application Note
Input Capacitor
A 1μF capacitor is recommended to connect between IN and GND pins to decouple input power supply glitch and noise. The input capacitor has no specific type or ESR (Equivalent Series Resistance) requirement. However, for higher current application, ceramic capacitors are recommended due to their capability to withstand input current surges from low impedance sources, such as batteries in portable applications. This input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper trace is required for both IN and GND.
Output Capacitor
A 0.1μF capacitor is recommended to connect between OUT and GND pins to stabilize and accommodate load transient condition. The output capacitor has no specific type or ESR requirement. The amount of the capacitance may be increased without limit. For PCB layout, the output capacitor must be placed as close as possible to OUT and GND pins, and keep the traces as short as possible.
ENABLE/SHUTDOWN Operation
The AP2281 is turned on by setting the EN pin high, and is turned off by pulling it low. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH.
DISCHARGE Operation
The AP2281-3 offers discharge option that helps to discharge the output charge when disabled.
AP2281 Rev. 1 8 of 9 JANUARY 2008 www.diodes.com © Diodes Incorporated
Power Dissipation
The device power dissipation and proper sizing of the thermal plane is critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by:
PD=IOUTxRDSON
2
(1)
However, the maximum power dissipation that can be handled by the device depends on the maximum junction to ambient thermal resistance, maximum ambient temperature, and maximum device junction temperature, which can be approximated by the equation below:
PD(max@TA)=
(+125°C−TA)
(2)
θJA
For example at VIN = 5V, the typical RDSON = 80mΩ. For IOUT = 2A, the maximum power dissipation calculated using equation (1) is PD = 0.32W. Based on SOT26 θJA = 153°C/W and equation (2), the calculated junction temperature rise from ambient is approximately 49°C. Since the maximum junction temperature is 125°C, the operating ambient temperature must be kept below 76°C to safely operate the device.
On the other hand, at TA = 85°C and VIN = 5V, the calculated maximum power dissipation from equation (2) is approximately PDmax = 0.26W. Hence the safe operating maximum continuous current is 1.81A. For other application conditions, the users should recalculate the device maximum power dissipation based on the operating conditions.
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AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Marking Information
(Top View)65473XX : U2 : AP2281-1 U3 : AP2281-3Y : Year: 0-9M : Month: A~LG : Green PackageXXYM X12SOT26
Package Information
IMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
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