专利名称：Process for selective cutting of electrical
conductive layer by irradiation of energybeam
发明人：Tsutomu Ogawa申请号：US06/478721申请日：19830325公开号：US04476375A公开日：19841009
摘要：A method for cutting an electrical conductive layer having a heat- absorbing filmdeposited thereon, by irradiating an energy beam on a portion of the electrical
conductive layer intended to be cut. The energy beam is irradiated on the film, wherebythe portion of the electrical conductive layer melts and alloys with the heat-absorbingfilm due to the energy absorbed and transferred by the heat-absorbing film.
申请人：FUJITSU LIMITED
代理机构：Staas & Halsey
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