Clamping device for flexible substrate and method

专利名称：Clamping device for flexible substrate and

method for fabricating the same

发明人：Chin-Jyi Wu,Chen-Der Tsai,Yun-Chuan Tu,Te-Chi Wong

申请号：US11391975申请日：20060328

公开号：US20070119044A1公开日：20070531

专利附图：

摘要：A clamping device for a flexible substrate is provided. The clamping deviceincludes a carrier board. The carrier board has a fixed positioning assembly and a plurality

of movable positioning assemblies. The fixed positioning assembly and the movablepositioning assemblies are disposed in locations that almost correspond to a plurality ofthrough holes on the flexible substrate. The fixed positioning assembly includes a holebody with a positioning hole and a dowel pin. Each movable positioning assembly includesa hole body with a positioning hole, a plurality of curved extending arms and a dowel pin.Each curved extending arm is connected to the hole body and the carrier board and thedowel pin is inserted into the positioning hole.

申请人：Chin-Jyi Wu,Chen-Der Tsai,Yun-Chuan Tu,Te-Chi Wong

地址：Baoshan Township TW,Hsinpu Township TW,Jhudong Township TW,YijhuTownship TW

国籍：TW,TW,TW,TW

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