Multi-chip module and method of manufacture

专利名称：Multi-chip module and method of

manufacture

发明人：Yin Lye Foong,Cheng Sim Kee,Lay Hong

Lee,Mohamed Suhaizal Bin Abu-Hassan

申请号：US11125396申请日：20050504

公开号：US20060249826A1公开日：20061109

专利附图：

摘要：A multi-chip module and a method for manufacturing the multi-chip modulethat mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a

support substrate. A spacer is coupled to the first semiconductor chip. A supportmaterial is disposed on the spacer and a second semiconductor chip is positioned on thesupport material. The second semiconductor chip is pressed into the support materialsqueezing it into a region adjacent the spacer and between the first and secondsemiconductor chips. Alternatively, the support material is disposed on the firstsemiconductor chip and a die attach material is disposed on the spacer. The secondsemiconductor chip is pressed into the die attach material and the support material,squeezing a portion of the support material over the spacer edges. Wirebonds areformed between the support substrate and the first and second semiconductor chips.

申请人：Yin Lye Foong,Cheng Sim Kee,Lay Hong Lee,Mohamed Suhaizal Bin Abu-Hassan

地址：Milpitas CA US,Bayan Lepas Penang MY,Penang MY,Pendang MY

国籍：US,MY,MY,MY

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