METHOD FOR PLATING RF EQUIPMENT AND RF EQUIPMENT M

专利名称：METHOD FOR PLATING RF EQUIPMENT

AND RF EQUIPMENT MANUFACTUREDTHEREFROM

发明人：JUNG, HYUN-YEONG,JUNG, MYOUNG-JOON申请号：EP09715938申请日：20090227公开号：EP2261399A4公开日：20140423

摘要：A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layerby applying copper plating to the RF device; and (c) forming a thin-film layer over thecopper plating layer, the thin-film layer made of a precious metal, where a thickness ofthe precious-metal thin-film layer is thinner than a skin depth at a working frequencyband. The disclosed method makes it possible to provide a plating treatment with a lowcost while providing a superior appearance quality.

申请人：ACE TECHNOLOGIES CORP.

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