专利名称：METHOD AND APPARATUS FOR
MEASURING TEMPERATURES IN
CONNECTION WITH MANUFACTURING OFA GLUE BOARD OR A CORRESPONDINGPRODUCT
发明人：HÄMÄLÄINEN, Sampsa,HYVÖNEN, Petri申请号：EP08857777.0申请日：20081111公开号：EP2288886A1公开日：20110302
摘要：The object of the invention is a method and an apparatus for measuringtemperatures in connection with the manufacturing of glue board (10) or a
corresponding product, wherein the glue board (10) is manufactured from wooden laths(2) that are placed adjacent to each other and glued together, in the gluing stage ofwhich the wooden laths (2) and the glued joints are heated and pressed against eachother with a press apparatus (7). According to the invention the temperature of at leastthe glued joints of the glue board (10) is measured after pressing by imaging the glueboard with a thermographic camera (9).
申请人：UPM-Kymmene Oyj
地址：Eteläesplanadi 2 00130 Helsinki FI
国籍：FI
代理机构：Salomäki, Juha Kari Ensio
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