专利名称：Method for manufacture of printed circuit
boards
发明人：Peter E. Kukanskis申请号：US06/875613申请日：19860618公开号：US04735694A公开日：19880405
摘要：A method of preparing printed circuit boards is described in which the soldermask on the circuit pattern and, optionally, the solder on the through-holes surroundingpads, and like areas to receive solder, is applied over a layer of lead covering the copperlayer at said loci. This method eliminates the need to strip tin-lead alloy etch resist whichstep is commonly employed in prior processes. The method overcomes the problemsassociated with migration of tin into the copper layer which can occur when tin-lead alloysare applied directly over copper.
申请人：MACDERMID, INCORPORATED
代理机构：St. Onge Steward Johnston & Reens
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