专利名称：Method of forming self-aligned via structure发明人：Chuen-Der Lien申请号：US08742704申请日：19961104公开号：US06372641B1公开日：20020416
专利附图：
摘要：A self-aligned via between interconnect layers in an integrated circuit, and aprocess for forming such a via which allows a less precise masking alignment to be usedto fabricate an integrated circuit with increased packing density.
申请人：INTEGRATED DEVICE TECHNOLOGY, INC.
代理机构：Skjerven, Morrill, et al.
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