ATTACHMENT MECHANISM FOR ELECTRONIC COMPONENT

专利名称：ATTACHMENT MECHANISM FOR

ELECTRONIC COMPONENT

发明人：ZHENG-HENG SUN申请号：US13434791申请日：20120329

公开号：US20130163215A1公开日：20130627

专利附图：

摘要：An attachment mechanism for an electronic component includes a circuit boardand a fastener. The circuit board includes a connector to connect to the electroniccomponent, and defines a mounting hole. The fastener includes a main body, two necks

extending from the main body, and two cantilevers extending from the main body. Tworesilient blocks extend from distal ends of each neck. The resilient blocks in a first enddeformably extend through the mounting hole; thereby the resilient blocks in the firstend abut against the circuit board after extending through the mounting hole. Theresilient blocks in a second end deformably extend through the electronic component;thereby the resilient blocks in the second end abut against the electronic componentafter extending through the electronic component. Two hooks extend from distal endsof the cantilevers to hook the electronic component.

申请人：ZHENG-HENG SUN

地址：Tu-Cheng TW

国籍：TW

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